Abstract
Experimental results are presented that show the effect of the addition of small amount of high-boiling organic liquid (dioctyl phthalate) on the boiling heat transfer from silicon chips mounted on the bottom surface of horizontal duct in which FC-72 is flowing slowly. The chip size was 10×10×0.5 mm. Significant increase in the critical heat flux, about twice as large as that for pure FC-72,was obtained in the range of liquid subcooling of 10 to 20 K.
