The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec)
Online ISSN : 2424-3124
2015
Session ID : 2A1-Q07
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2A1-Q07 Design of the haptic device using the parallel wire mechanism With an extrusion mechanism
Yuto MURAKAMITakahiro TOMIUTIMasaru HIGUCHI
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Abstract
This report describes the design of a haptic device for the skill assist system which realizes high performance human operations. We adopted a wire parallel mechanism as this haptic device. This haptic device must not interfere with not only human but also operating objects. There is a high possibility of interference of ordinary parallel wire mechanisms With an extrusion mechanism. And to realize high transparency and large force, the new wire driving mechanism was proposed. It drives wire without reducer. But it has a driving puller and an idler pulley on which wire are winded many times. The prototype of the haptic device was designed and fabricated
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© 2015 The Japan Society of Mechanical Engineers
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