Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : June 08, 2016 - June 11, 2016
We proposed a stretchable and bendable electronic device by folding deformation. We used Miura-ori that is a kind of origami folding for folding deformation. However, original Miura-ori is a rigid folding and its deformation is restricted. When Miura-ori bend to out-of-plane, it has saddle-shaped deformation mode and it is unable to stick on sphere. Therefore, we developed Miura-ori which has holes on intersection points of mount and valley creases to be enable to bend without saddle-shaped deformation and stick on sphere. In this paper, we evaluated effect of hole size on the interaction points that is enable to stick on sphere and concluded 30% of one side of the rhombus plane in Miura-ori is appropriate. As a result, we achieved an electronic device which is possible to folding, deployment and bending deformations without wiring cracking.
