Design of MEMS Tactile Sensor Mounting Method on Flexible Printed Circuit for Reducing Mechanical Stress

Abstract

This paper describes a mounting design for extracting electric signals from a Si substrate of a MEMS tactile sensor. In the conventional mounting design of MEMS, bonding wires have been widely used to extracting signals. However, in the case of a tactile sensor where the external force on the order of Newton acts on the device, the bonding wires have been cut very often. Therefore, we proposed a new design using a Flexible Printed Circuit that reduced the load on the contacts on the MEMS and confirmed the effect by measuring external force.