Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : June 06, 2021 - June 08, 2021
This study proposes a headphone device insulating specific frequency noise utilizing Helmholtz resonator arrays (HR arrays). The HR arrays are designed based on a honeycomb structure and consist of HR units attenuating noise and penetration hole units for sound path. The proposed HR arrays was fabricated using an SLA 3D printer. The numerical analysis and experiment showed similar frequency response. It was confirmed that the fabricated HR arrays worked as acoustic notch filters. The fabricated HR arrays were integrated on a headphone-type device. We investigated its sound insulation performance via a dummy head microphone. The experimental result fully satisfied the required performance.
