Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : November 15, 2024 - November 17, 2024
In this study, a walking motion analysis method was developed by a shoe equipped with an embedded ultrasmall multi-axis tactile sensor. The shoe made it possible to measure the three-dimensional forces acting on the foot anywhere while walking. This study aimed to explore the application of a shoe with embedded sensors for micro-level 3-dimensional forces motion evaluation. We conducted two experiments. First, we focused on small areas of the sole where the sensors were embedded and measured the loads applied to the foot using tactile sensors. As a result, we confirmed that embedding sensors with an elastomer facing the sole enables the measurement of 3-dimensional forces acting on the foot. Additionally, we investigated the potential for motion analysis by attaching sensor-embedded shoes to a simulated foot and verified the capability to measure the forces acting on the foot.