抄録
Recently, the demand for fabricating the simple microstructure of silicone, such as groove of MEMS device, by simple method is increasing. We investigate the laser-assisted wet etching technique to meet this demand. This method has the possibility of maskless processing and is good for various small-lot production. Also the laser-assisted wet etching is superior to laser ablation or micro lathe in fine dust free. In the experiment, silicon etching was performed by using short pulse laser and the feasibility of the laser-assisted wet etching of silicon is exhibited. We are going to perform a numerical calculation to understand the physical aspects of the etching technique.
