高周波インダクタの損失計算を統合した熱解析モデル化手法(オーガナイズドセッション9 マイクロマシン/電子デバイスにおける伝熱問題)

抄録

We have proposed compact thermal modeling method for high-frequency inductors that takes into consideration the effect of proximity losses and the effect of anisotropic effective thermal conductivity on the winding surface temperature. The modeling method was developed on experimental dummy inductor, and the power loss of the inductor was prescribed in advance. However, in many actual cases, the rate of heat dissipation from the high-frequency inductor is unknown or difficult to estimate precisely. From the viewpoint of practical use at the design phase, it is necessary to develop the thermal modeling method that is integrated with power loss calculation method. This paper describes the power loss calculation method for the high-frequency inductor used as a boost choke in switch mode power supplies.