抄録
The thermal resistance of cooling device using forced oscillatory flow was examined experimentally. In addition, a numerical simulation using the thermal network method was carried out to investigate the influence of the frequency and the tidal displacement of the oscillatory flow and the channel pattern on the thermal resistance. The heat spreader is a thin copper plate with the thickness of 1.2mm that contains a 0.8mm square channel. The experimental results indicated that the surface temperature of the heat spreader is decreased by the forced oscillatory flow in the heat spreader.
