抄録
For a practical thermal design of the electronic equipment, an efficient thermal design technique is needed. There is a Build-Up Approach concept in one of the convincing technique. In this study, a CFD and a thermal network method have been combined toward the BUA. Heat and fluid flow in a card-type device were simulated with the CFD at first. The thermal network method is applied to the parametric survey with the aim of obtaining design guides. This approach makes design time shorter. The results of experiments, the CFD, and the thermal network method were compared and the application possibility of this approach was examined.
