The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2007
Session ID : C124
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C124 Unsteady Heat Conduction of Composite Materials Using Micro Encapsulated Phase Change Materials (MEPCM)
Kenzo YoshinoriDaisuke KatsuragiJumpei OgawaHaruo Soeda
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Abstract
In this paper, the one-dimensional unsteady heat conduction experiments of silicon gum and composite silicon gum using MEPCM were conducted in order to validate numerical simulation model for unsteady heat conduction of composite materials using MEPCM. Here, silicon gum which contained MEPCM by 30wt% was made, and temperature profile of internal of it was measured by thermocouples. As a result, temperature response of composite silicon gum of MEPCM was slower than one of silicon gum, due to latent heat of MEPCM. It was also confirmed that temperature profile of composite one was nonlinear. Next, using these experimental data, we are going to validate numerical simulation model.
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© 2007 The Japan Society of Mechanical Engineers
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