抄録
We have developed a nanoporous composite thermal insulation that consists of fumed silica (SiO_2). This insulation has ultra low thermal conductivity, because the mean free pass of air included in the insulation is limited by the mean size of the pore inside. However, the ways of jointing thermal insulations each other become serious problems, when setting up them on the buildings, furnaces, houses, etc. Especially, when using the developed thermal insulation, a large amount of heat should be lost from the jointing part. Because adhesives, whose thermal conductivity is larger than one of the developed thermal insulation, are used for jointing each surfaces of the specimen. Therefore, it is very important to know the thermal properties of the jointing part of the specimen. Here, it was shown that no adhesive in the jointing part was more proper, when using the developed thermal insulation
