G112 The Thermal Design for Mobile Phones by Using Thermal Simulation System

Abstract

The thermal issue is critical in development of Mobile Phones, which tend to be downsized and consumes more power. We use thermal simulation to estimate thermal behavior, and decide the design of product. To be put into practice, thermal simulation must be done in short time and bring a necessary and sufficient accurate result. In this paper, we talk about equivalent thermal conductivity of print circuit boards under electronic components and boundary conditions of heat transfer to human fingers/palm.