抄録
Isotropic conductive adhesives (ICAs) have been applied to die attachment materials for power devise and LED. The thermal characterization of ICAs is important to thermal management. We developed steady state comparative-longitudinal heat flow method using cartridge type specimens. Thermal conductivity of silver-epoxy conductive adhesive and interfacial contact thermal resistance between the conductive adhesive and the bonded interface were evaluated. The results showed that the measurement method has capability to measure thermal conductivity within 10% of uncertainty. Additionally, the interfacial contact resistance of ICAs affect thermal conductance at thin thickness.
