Abstract
Fundamental thermal performance of a liquid cooling system for small electronic equipment has been studied. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a Mini-pipe and pulsatile laminar flow with Microencapsulated Phase Change Material (MEPCM). The coolant including the MEPCM with an average diameter of 4 μm was circulated in the flow channel including the Mini-pipe having a diameter of 2 mm. The mass concentration of MEPCM was changed from 0 to 5 %. The increase of the MEPCM mass concentration enhances convective heat transfer.
