C114 マルチコアプロセッサのダイ周りの非定常熱伝導シミュレーション(OS-7:電子機器における熱流動現象(I))

抄録

This paper introduces power estimation equation for the multi-core microprocessor and describes transient heat conduction simulation using the equation on simplified thermal model by sub-millisecond time step. With the latest CMOS process technology, microprocessor's current is not only voltage but also temperature dependent due to leakage. Unlike steady state analysis, transient analysis requires power information for each time step to calculate temperature on each time step. Moreover, since temperature and power interact with each other through temperature dependent power estimation equation, precise power estimation is critical for microprocessor's transient thermal analysis. While, sufficient heat conduction path expression is important for transient heat conduction simulation and is investigated in this paper.