For further development of semiconductor integrated circuit, SD-integrated circuit has been proposed. To realize SD-integrated circuit, a chip reliability test without dicing 300 mm^φ wafer is required. The test technology requires following features: wafer level (without dicing 300 mm wafer), precise temperature control between 100 and 125 degree C, heat removal capability of 15 kW/300mm^φ. Therefore, in this research, we developed advanced chip reliability test technology using latent heat of water vaporization. We divided 300 mm wafer into 69 parts and water is sprayed to each part against gravity. On the wafer, temperature is not uniform because the heat generation is different among the wafer caused by yield distribution. Since the sprayed water is controlled separately, the system can maintain the uniform temperature on the wafer. As a result of evaluation of this system, we achieve precise temperature control from 70 to 150 degree C at the heat flux of 0.1 to 20 kW.
