F213 圧密充填された粒子充填体のミクロ構造とマクロ熱伝導率(OS-6:多孔質の最近の進展(2))

抄録

The present paper deals with simulation of microstructure and macroscopic thermal conductivity of randomly packed, uniaxially pressed and sintered particles. Random packings of identical spheres are constructed by using a sequential deposition method and their microgeometry after the compaction in sintering is geometrically created by proportional reduction in distances between the sphere centers only in the vertical direction and by mass addition around overlapped necks. Using the data on the packings and geometrical models, macroscopic thermal conductivities of the compacts are estimated. It is found that the conductivities are greatly different from those of simple cubic packings, although both the packings have almost the same coordination number, and that anisotropy in the conductivity is induced by the compaction in addition to gravity. The conductivities are expressed as a function of the compaction and sintering degrees for practical purposes.