抄録
We have been developing the thermal conductivity measuring method of flat plate such as printed wiring board (PWB) in a direction parallel to the plane of the board by fin temperature fitting method. In this method, we applied the correlated heat transfer coefficient around the horizontally set specimens from the prior experiment with known thermal conductivity. From the experimental investigation, we obtained the following conclusions. (1) By using the correlated heat transfer coefficient, in-plane thermal conductivity of the horizontal specimen plate is obtained within 10 % dispersion in the range of fin efficiency 0.2〜0.8. (2) The thermal conductivity of 10 layered PWB was 3 times larger than the 2 layered PWB.
