D122 Transient Heat Conduction Simulation around Microprocessor Die Investigation of Variable Cooling Performance by Heatsink Fan

Abstract

This paper utilizes power estimation equation for the microprocessor which was introduced in former work by the author and describes transient heat conduction simulation for the lidless micro PGA (Pin Grid Array) processor. Not only temperature and voltage dependency of microprocessor power consumption but also cooling performance expression is critical for transient heat conduction simulation. Therefore, this paper tries to focus the expression of cooling performance by heatsink fan including the case of changing fan speed.