The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2011
Session ID : D123
Conference information
D123 Numerical Simulation and Experimental Verification of Cooling Effect for Precision Positioning Device by Peltier Module
Kenji TaneishiJiro OtsukaNing ZhuShigeomi KoshimizuTakeki ShiraiTomozumi MurataTsutomu TogashiHirofumi Ohsawa
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Abstract
In order to decrease the thermal displacement drift of the precision positioning device, so far, many cooling methods have been suggested and some of them have been already applied to the actual positioning system. In this report, the normal-type positioning device in which ball screw was indirectly connected with the motor shaft by a coupling, together with the moving stage and the support unit of ball bearing were cooled by three Peltier modules. As a result of a serial experiment, it is found that with the introduction of the Peltier modules, the heated positioning system could be cooled back to the room temperature and the thermal displacement drift was effectively decreased. Besides, the temperature distribution inside the ball screw and the bearing was numerically calculated.
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© 2011 The Japan Society of Mechanical Engineers
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