The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2012
Session ID : H112
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H112 In-plane thermal conductivity measurement by straight fin temperature fitting method using one point radiation thermometer
Tetsuro Ogushi
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Abstract
We have been developing an in-plain thermal conductivity measuring method of flat plate specimen such as printed wiring board (PWB) by straight fin temperature fitting method. We applied one point radiation thermometer axially moving automatically for measuring the axial temperature distribution of the speciment. From thr experimental investigation, we obtained the following conclusions. (1) By applying the temperature fitting to the range of above 5K temperature rise, the in-plane thermal conductivity of the specimen was obtained within 10% dispersion under the condition of the fin efficiency of 0.2〜0.85 in spite of temperature fluctuation of ±1K of one point radiation thermometer. (2) By using mean heat transfer conductivity of the specimen was obtained within 10 % dispersion under fin efficiency lower than 0.2.
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© 2012 The Japan Society of Mechanical Engineers
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