Abstract
Our study aims to apply the flow and thermal resistance network analysis (coupled network analysis) to thermal design of fan-cooled high-density packaging electronic equipment. This paper especially tried to predict a net cooling performance of the finned heat sink when there is top bypass on the heat sink by using the coupled network analysis. In order to predict an accurate cooling performance of the finned heat sink, a net flow rate between the heat sink fins has to be predicted. We developed a flow resistance network model around the finned heat sink. In order to predict a distribution of flow rate around the heat sink, both the flow resistance between the heat sink fins and the resistance of bypass were considered.
