抄録
From the viewpoints of advances in Electronic Devices, various cooling systems by air cooling and liquid cooling have been studied. However, these systems have some difficulty in downsizing because of the increase in power consumption and system structure. Chemical Heat Pump (CHP) can drive only by the device exhaust heat and downsize for the simple structure. In this work, we performed experiments and simulation of CHP using hydration/dehydration of CaSO_4/CaSO_4・1/2H_2O. As a result, the experiments and simulation showed the possibility of cooling of electronic devices using CHP driven only by the device exhaust heat.
