抄録
Concerning the heat removal from the systems like electronic equipment, satellite thermal control device and so on, the reduction of the thermal contact resistance is a quite crucial issue to be tackled. In this study, the thermal contact resistance between dissimilar materials with flat rough surface has been investigated experimentally under comparatively low mean contact pressure of 0.1 to 1.0 MPa. From comparison between the measured and predicted results, it has been shown that, even under such low mean contact pressure, the temperature drop at the contact interface can be predicted satisfactorily by using the conventional prediction equation based on the unit cell model.
