The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2015
Session ID : A212
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A212 Immersion Cooling utilizing Lotus-Type Porous Copper
Kazuhisa YukiTomohiro HaraSoichiro IkezawaKoichi SuzukiTetsuro OgushiTakuya IdeMasaaki Murakami
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Abstract
This paper evaluates pool boiling heat transfer with lotus-type porous copper on a heated surface. The experiments are performed under atmospheric and saturated conditions. The lotus porous medium has unidirectional pore structure and the averaged size of the pore hole is 0.4 mm. The porous plate of 1.0 mm or 2.0 mm in thickness is mechanically attached onto the heated surface. The boiling curves suggest that utilization of the lotus porous medium definitely leads to boiling heat transfer enhancement. However, the results also prove that the thickness of the lotus porous doesn't affect the boiling heat transfer rate and that there is a big contact thermal resistance between the heated surface and the lotus plate.
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© 2015 The Japan Society of Mechanical Engineers
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