The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2015
Session ID : A213
Conference information
A213 Development of an analysis error reduction method for BGA package two-resistor thermal models
Sakae Kitajo
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Recently, Computational Fluid Dynamics is widely used in electronic equipment thermal design process. With regard to semiconductor packages in electronic equipment, two-resistor thermal models are usually available in order to reduce thermal simulation calculation time. However, it is known that two-resistor models include several kinds of calculation error. In this study, a calculation error reduction method for two-resistor thermal models is newly developed. Novel error reduction method applying to BGA packages consists of three steps to correct package thermal resistances measured by JEDEC method. Usually, more than 20% junction temperature rise error occurs in various cooling condition such as fan cooling and heat-sink cooling. In our study, it is clarified that less than 5% error of calculated temperature rise could be achieved in almost cooling conditions.
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© 2015 The Japan Society of Mechanical Engineers
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