熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: A212
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A212 ロータス型ポーラス銅による浸漬沸騰冷却(OS-7: 電子機器・デバイスの熱工学的課題と熱流動現象(3))
結城 和久原 知寛池澤 宗一郎鈴木 康一大串 哲朗井手 拓哉村上 政明
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This paper evaluates pool boiling heat transfer with lotus-type porous copper on a heated surface. The experiments are performed under atmospheric and saturated conditions. The lotus porous medium has unidirectional pore structure and the averaged size of the pore hole is 0.4 mm. The porous plate of 1.0 mm or 2.0 mm in thickness is mechanically attached onto the heated surface. The boiling curves suggest that utilization of the lotus porous medium definitely leads to boiling heat transfer enhancement. However, the results also prove that the thickness of the lotus porous doesn't affect the boiling heat transfer rate and that there is a big contact thermal resistance between the heated surface and the lotus plate.

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