Abstract
The present paper aimed to clarify the boiling heat transfer, especially the mechanism of the critical heat flux. Pool boiling experiments were conducted the copper thin film on the silicon wafer by the sputtering. Test liquid was distilled water. The system pressure was 0.01 and 0.10 MPa, respectively. Boiling heat transfer mechanism was examined through two-dimensional temperature field and high speed observations of the boiling bubble. Temperature of the test heater was measured by using a infrared thermometer from a back side of it. The temperature fluctuation on the test heater was considered with bubble behavior.
