The Proceedings of the Thermal Engineering Conference
Online ISSN : 2424-290X
2016
Session ID : A234
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Applicable Conditions of Local Thermal Conductivity Measurement by Contact Temperature Method
Hoshi KawamuraOsamu Nakabeppu
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Abstract

The purpose of this study is a development of the local thermal conductivity measurement method by contact temperature method. In this paper, the applicable conditions of this method were examined. First, by the numerical simulation of heat conduction and the measurement test for non-conductive materials coated with gold film, it was found that the proposed method with the platinum wire probe is useful for thermal conductivity of 1 to 100 W/mK. Spatial resolution of this system was also examined. It was noted the resolution for low conductivity sample is approximately 100 μm.

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© 2016 The Japan Society of Mechanical Engineers
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