パルスレーザによる透明材料加工メカニズムの解明

抄録

Transparent materials have been gaining more and more attention in a wide range of applications, such as ICT equipment and energy conversion devices, with continuously increasing demand in the future. Such applications require micromachining of the materials that conventional mechanical machining cannot achieve. Although the pulsed laser machining is most promising, further understandings of the basic phenomena is needed. In this study, we conduct the experiment and the calculation of nanosecond pulse laser machining of fused silica. In addition, we conduct high speed visualization of plasma during processing because plasma shielding is a problem for laser machining.