Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 20, 2018 - October 21, 2018
With rapid development and miniaturization of electronic devices, the internal heat generation from semiconductors becomes significantly denser. Hence, the passive two-phase cooling techniques are being applied in heavy loaded devices. In this study, a gravity-driven R1234ze(E) circuit is experimentally investigated. LISS (Laser Interference Surface Structuring) and finned boiling surfaces are tested in this circuit and compared. The boiling heat transfer coefficient increases by 82% and 36% by LISS and finned surfaces, respectively. Thus, total thermal resistance is reduced by 18 % and by 12% with LISS and finned surfaces, respectively. LISS is a promising technique to enhance cooling performance of thermosiphons.
