Evaluation of Thermal Contact Resistance Under High Heat Flux Considering Material Hardness Using Numerical Analysis

Abstract

This paper describes the contact thermal resistance reduction by the thermal stress. In this paper, deformation volumes in copper, aluminium and silver, which are applied thermal stress, are calculated using finite element method. From these results, aluminium has a large deformation volume and a large reduction of thermal resistance. The thermal conductivity, however, is lower, and the thermal resistance does not become lower. The deformation volume has vary by the materials, and this volume should be consider for high accurate thermal design.