Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 12, 2019 - October 13, 2019
In this study, HFO (Hydrofluoroolefin)-based insulating mixed refrigerant is proposed for liquid cooling systems of electronics. To improve the cooling performance, the mixing solvents and their mixing ratios were determined by optimizing thermophysical properties such as thermal conductivity and specific heat of the mixed refrigerant. The optimized properties were obtained by employing the Digital Annealer (DA), which is a new technique for solving combinatorial optimization problems at a high speed using digital circuits. It was experimentally verified that the heat transport performance of the liquid cooling system incorporating the proposed mixed refrigerant can improve by 12% or more compared with the base HFO. This work demonstrates the possibility of applying DA to the fields of chemical and thermal engineering.
