3D semiconductor package model for precise thermal analysis

Abstract

Regarding semiconductor package models used for thermal analysis of electronic devices. For example, the DELPHI model is specified in JEDEC JESD15-4, but the detailed model has no standard. Therefore, model abstraction depends on the manufacture of the semiconductor device you are creating. Users using it cannot compare and validate their models under the same conditions. On the other hand, semiconductor device manufacturers need to hide as much as possible internal structures and materials that are competing fields. In this research, in order to solve this subject, the parameter that influences a thermal-analysis result was specified, and the highly precise JTAM model (JEITA Thermally Accurate Model) was developed by the minimum input. This improves the distribution of thermal analysis models and creates an environment where users can easily compare parts.