オープンセル型銅フォームを用いた車載電子機器用複合放熱部材の熱伝導率評価

抄録

Thermal management has become a big problem with the increasing performance and miniaturization of electronic devices. In particular, in-vehicle electronic devices are not only subjected to high temperatures but also have to sustain impact loading, thus there has to be a gap between the heat-generating component and its enclousure. As such, there is a need to improve the heat transfer characteristics of heat dissipating materials which have adequate elasticity. In this study, a Thermal Interface Component (TIC) was prepared by impregnating an open-cell type copper foam with a hardenable gap filler, and the effective thermal conductivity was measured. We also compared the effective thermal conductivity culculated with existing models and previously measured data.