主催: 一般社団法人 日本機械学会
会議名: 熱工学コンファレンス2019
開催日: 2019/10/12 - 2019/10/13
In recent days, thermal design engineers of electronic devices in Automotive industry and electrical industry need to analyze a complex geometry consisting with a hundred/a thousand parts for thermal as well as structural analysis simulation. The modelling method has been achieved "Digital Twin" concept, and that simulation software are thus significantly required high performance gridding and processing capabilities. This paper describes the current trend of thermal simulation tools for thermal design engineer with some examples as well as the latest Computational Fluid Dynamics (CFD) features and demands are shown.