主催: 一般社団法人 日本機械学会
会議名: 熱工学コンファレンス2019
開催日: 2019/10/12 - 2019/10/13
In this study, we developed a MEMS heat flux sensor to measure surface local heat transfer in flow boiling in a minichannel. The MEMS heat flux sensor has stacked structure of two thin film temperature sensors, and the local heat flux can be analyzed by 1-D transient heat conduction simulation using the measured two temperatures as boundary conditions. The measured heat flux clearly shows thin film evaporation with a high heat flux over 1MW/m2, dry-out of the thin liquid film and rewetting of the dried surface. The developed sensor was confirmed to be a powerful tool to explore the boiling heat transfer mechanisms.