主催: 一般社団法人 日本機械学会
会議名: 熱工学コンファレンス2020
開催日: 2020/10/10 - 2020/10/11
p. 0151-
The importance and variety of thermal design in small electronic devices have increased in recent years, and the need for thermal control for multiple heat sources in small electronic devices has also arisen. Therefore, in this research, we newly proposed an ultra-thin multi-evaporator type loop heat pipe (UTMLHP) as a useful heat diffusion device and evaluated its characteristics from heat load experiments under various conditions. In this paper, regarding the behavior when heating on one side, the encapsulation amount and posture of UTMLHP were changed, and the motion characteristics were examined under the conditions of 9 patterns. We also report the internal flow behavior revealed by the constructed analytical model.