熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: 76
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シミュレーションを利用した発熱量推定方法の開発
*梶田 欣立松 昌壁谷 真人
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Three dimensional numerical analysis is utilized for thermal design of electronic devices. In this calculation, power consumption of electronic component are needed for input values, and they have an important consequence for prediction accuracy. But, it is often the case that the values are imprecision, because it is not well defined to measure or calculate the values at the moment. We developed an estimation method using temperature measurements and thermal analysis. We obtained a parameter about thermal of electronic components in advance. Next, the temperature of each electronic components was measured. Then, the power consumption can be obtained using them. This estimation method is effective because it does not require special equipment.

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