Novel Thermophysical Property Analysis Technique by Using Combined Electrical-Pump Thermoreflectance Method and Structure Function

Abstract

A high-power resistor is prone to excessive temperature rise and requires an appropriate thermal design and a temperature control based on a transient thermal analysis. This study proposes a new thermophysical property analysis method that combines electrical-pump / optical-probe type thermoreflectance method and a structure function for relatively thick film materials such as resistors. Specifically, the thermoreflectance method with rectangular pulse heating enables temperature measurement in the time range of several μs to several tens of ms, which could not be evaluated with existing methods. Furthermore, we attempted to simultaneously analyze the thermal conductivity and specific heat capacity of the film material by creating a structure function from the acquired transient temperature rise waveform. In this report, we will report the proposal of new technique as well as the conduction heat transfer in the film structure.