抄録
Experiments of the ultrasonic die sinking of circular holes have been carried out on silicon carbide (SiC) workpiece by using mild steel tool (S45C). It is observed that there arises an uncut part of the material at the center of the bottom of the machined hole on the workpiece. The machining rate decreases due to the existence of the uncut part of the material, which grows up gradually as the machining advances. It is influenced by the various process parameters including the properties of the tool material, slurry and dimension of the tool. Abrasive motion mechanisms were investigated by CCD camera and through SEM.
