The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2009.44
Session ID : 123
Conference information
123 Grain growth mechanism undercyclic loading in electroplated copper thin films.
Kinji TAMAKAWA, Naokazu MURATA, Hideo MIURA
Author information
Keywords: Micromechanics, Stress Measurement, Grain Growth Mechanism, Electroplated Copper Thin Films, Stress Concentration
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (428K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2009 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top