The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2014.49
Session ID : 145
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145 Clarification of the dominant factors of stress-induced migration in through silicon via (TSV) interconnections used for three-dimensional electronic packaging
Ryosuke Furuya, Ken Suzuki, Hideo Miura
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Keywords: Reliability, Residual stress, Thin Films, Electronic Packaging, Through Silicon Via
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© 2014 The Japan Society of Mechanical Engineers
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