The Proceedings of Conference of Tohoku Branch
Online ISSN : 2424-2713
2014.49
Session ID : 146
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146 Visualization of the degradation process of electroplated copper thin-film interconnections caused by electromigration, and improvement of their reliability
Osamu Asai, Ken Suzuki, Hideo Miura
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Keywords: Reliability, Electromigration, Atomic Diffusion, Grain Boundary
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© 2014 The Japan Society of Mechanical Engineers
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