The Proceedings of Autumn Conference of Tohoku Branch
Online ISSN : 2424-2721
2004.40
Session ID : 112
Conference information
Assessment of Drop Impact Reliability for BGA Solder Joints : Development of the Dropping Test Method
Qiang YU, Keiji WATANABE, Toshihiro TSURUSAWA, Masaki SHIRATORI, Manabu KAKINO, Noriyuki FUJIWARA
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Keywords: Drop impact reliability, Transient response analysis, Repetitive drop test
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© 2004 The Japan Society of Mechanical Engineers
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