The Proceedings of Autumn Conference of Tohoku Branch
Online ISSN : 2424-2721
2009.45
Session ID : 101
Conference information
101 Measurement of local deformation and residual stress in electronic modules
Kohta Nakahira, Hiroki Kishi, Ken Suzuki, Hideo Miura
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Keywords: Reliability, Micromechanics Residual Stress, Experimental Mechanics, Semiconductor Electronic Packaging
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[in Japanese]
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© 2009 The Japan Society of Mechanical Engineers
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