The Proceedings of Conference of Tokai Branch
Online ISSN : 2424-2748
2013.62
Session ID : 535
Conference information
535 Evaluation of the effect of copper grain structure to Cu/SiN interfacial adhesion strength in LSI using crack propagation simulation
Mandakhzul NAMSRAI, Kozo KOIWA, Masaki OMIYA, Nobuyuki SHISHIDO, Shoji KAMIYA, Hisashi SATO, Masahiro NISHIDA, Takashi SUZUKI, Tomoij NAKAMURA, Toshiaki SUZUKI, Takeshi NOKUO
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Keywords: LSI, Grain structure, Adhesion, Simulation, Crystal plasticity
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© 2013 The Japan Society of Mechanical Engineers
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