The Proceedings of Conference of Tokai Branch
Online ISSN : 2424-2748
2013.62
Session ID : 534
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534 Influence of Cu Crystal Orientation on Local Adhesion Strength of Interface Between Cu and SiN Semiconductor Device Wirings
Yuka Oura, Hiroko Sugiyama, Nobuyuki Shishido, Shoji Kamiya, Hisashi Sato, Kozo Koiwa, Masahiro Nishida, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo
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Keywords: Semiconductor device wiring, Adhesion strength, Interface, Cu Single grain
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© 2013 The Japan Society of Mechanical Engineers
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