The Proceedings of Conference of Tokai Branch
Online ISSN : 2424-2748
2013.62
Session ID : 534
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534 Influence of Cu Crystal Orientation on Local Adhesion Strength of Interface Between Cu and SiN Semiconductor Device Wirings
Yuka OuraHiroko SugiyamaNobuyuki ShishidoShoji KamiyaHisashi SatoKozo KoiwaMasahiro NishidaMasaki OmiyaTakashi SuzukiTomoji NakamuraToshiaki SuzukiTakeshi Nokuo
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© 2013 The Japan Society of Mechanical Engineers
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