Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2001
Session ID : 441
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441 The Effect of The Dynamic Characteristic in The Falling and Impact on Solder Joints
Qiang YU, Masaki SHIRATORI, Shinya IKEDA, Hironobu KIKUCHI
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Keywords: FEM, Solder Joint, BGA Package, Dynamic Analysis, Response Analysis, LS-DYNA, NASTRAN
CONFERENCE PROCEEDINGS FREE ACCESS

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© 2001 The Japan Society of Mechanical Engineers
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